Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP : EOS/ESD; Electrostatic discharge reliability
In: MICROELECTRONICS RELIABILITY 49(12):1476-1481; Jg. 49 (2009) 12, S. 1476-1481
Konferenz
Zugriff:
Titel: |
Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP : EOS/ESD; Electrostatic discharge reliability
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Autor/in / Beteiligte Person: | Wolf, H. ; Gieser, H. ; Walter, D. |
Link: | |
Quelle: | MICROELECTRONICS RELIABILITY 49(12):1476-1481; Jg. 49 (2009) 12, S. 1476-1481 |
Veröffentlichung: | 2009 |
Medientyp: | Konferenz |
ISSN: | 0026-2714 (print) |
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