Fabrication of 3-Layer Stacked Pixel for Pixel-Parallel CMOS Image Sensors by Au/SiO~2 Hybrid Bonding of SOI Wafers : Semiconductor wafer bonding: science, technology, and applications (Symposium)
In: ECS transactions 98(4):167-172; Jg. 98 (2020) 4, S. 167-172
Konferenz
Zugriff:
Titel: |
Fabrication of 3-Layer Stacked Pixel for Pixel-Parallel CMOS Image Sensors by Au/SiO~2 Hybrid Bonding of SOI Wafers : Semiconductor wafer bonding: science, technology, and applications (Symposium)
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Autor/in / Beteiligte Person: | Goto, M. ; Nakatani, N. ; Honda, Y. ; Watabe, T. ; Nanba, M. ; Iguchi, Y. ; Saraya, T. ; Kobayashi, M. ; Higurashi, E. ; Toshiyoshi, H. |
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Quelle: | ECS transactions 98(4):167-172; Jg. 98 (2020) 4, S. 167-172 |
Veröffentlichung: | 2020 |
Medientyp: | Konferenz |
ISSN: | 1938-5862 (print) |
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