The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite
In: Vacuum, Jg. 214 (2023)
serialPeriodical
Zugriff:
Titel: |
The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite
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Autor/in / Beteiligte Person: | Wang, Chan ; Chen, Jian ; Shao, Wenting ; Liang, Shuhua |
Link: | |
Zeitschrift: | Vacuum, Jg. 214 (2023) |
Veröffentlichung: | 2023 |
Medientyp: | serialPeriodical |
ISSN: | 0042-207X (print) |
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