Accurate measurement and characterisation of MCM-D integrated passives up to 50 GHz
In: High-density interconnect and systems packaging (Denver CO, 25-28 April 2000)SPIE proceedings series :307-312
Konferenz
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Zugriff:
Multi-layer CPW-based models are not readily available in commercial simulators. Therefore, a set of teststructures (inductors, resistors, capacitors, transmission lines, discontinuities,…) has been realized to fully characterize IMEC's MCM-D technology. Scaleable models have been created and implemented in a design library offering automated layout. In this paper, the capacitors (both BCB as Ta2O5 in series and shunt-to-ground configuration), transmission lines and transmission line discontinuities are described in more detail. First, the choice of calibration method is motivated, then the developed models are discussed. Scaleable models for square capacitors have been developed. A transmission line-based model has been used, as this is able to accurately represent the measured S-parameters. Examples are given on how a proper layout can improve the high-frequency performance of the capacitors. The transmission line parameters (propagation constant and characteristic impedance) have been extracted using a TRL-based technique. The models for the transmission line discontinuities, including shorts, opens, T-junctions, X-junctions, bends, bridges and vias, are also described.
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Accurate measurement and characterisation of MCM-D integrated passives up to 50 GHz
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Autor/in / Beteiligte Person: | CARCHON, G ; BREBELS, S ; VAESEN, K ; PIETERS, P ; SCHREURS, D ; VANDENBERGHE, S ; DE RAEDT, W ; NAUWELAERS, B ; BEYNE, E |
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Quelle: | High-density interconnect and systems packaging (Denver CO, 25-28 April 2000)SPIE proceedings series :307-312 |
Veröffentlichung: | Bellingham WA: SPIE, 2000 |
Medientyp: | Konferenz |
Umfang: | print, 7 ref |
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