Degradation zones of semiconductor target (Si) formed as a result of nanosecond UV laser material processing
In: In-line methods and monitors for process and yield improvement (Santa Clara CA, 22-23 September 1999)SPIE proceedings series :269-276
Konferenz
- print, 8 ref
Zugriff:
The results of laser - semiconductor material interaction are presented. The laser source for these experiments was an UV laser at 0,34 mkm wavelength with 7 ns pulses at 100 Hz repetition rate focused at the spot of 3 mkm diameter, laser fluence was more than 1,1 J/ sq cm corresponding to the minimum energy density required to forming kerf. Material of target was p-Si with thermal oxide silicon. We have investigated changes of electrophysical (dynamic and static) perfomance of diagnostic structures vs. distance between the edge of laser kerf and the edge of diagnostic structures for definition of characteristic zones around the spot of laser - material interaction. The diagnostic structures included p-n junction or source of MOSFET. From the measurement made, back current for p-n junction and transfer characteristic for MOSFET and time carrier storage in source capacity of MOSFET were studied. We have determined the 3 zones around the spot of laser material processing.
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Degradation zones of semiconductor target (Si) formed as a result of nanosecond UV laser material processing
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Autor/in / Beteiligte Person: | NOVOSELOV, A. R ; KLIMENKO, A. G |
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Quelle: | In-line methods and monitors for process and yield improvement (Santa Clara CA, 22-23 September 1999)SPIE proceedings series :269-276 |
Veröffentlichung: | Bellingham WA: SPIE, 1999 |
Medientyp: | Konferenz |
Umfang: | print, 8 ref |
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