A modular concept for the design of application specific integrated telemetric systems
In: Design, test, integration, and packaging of MEMS/MOEMS (Cannes, 25-27 April 2001)SPIE proceedings series :246-253
Konferenz
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Zugriff:
Modern microsystem technology generates a great variety of very small sensors and actuators. With the use of capacitive measurement or moving principles these components have a very low power consumption and with some data preprocessing they can be used in passive telemetry systems, which need no integrated battery. Instead, they use two loosely coupled coils to realize the energy transfer. To create very small systems, e.g. for the implantation inside the human body, the use of an application specific integrated circuit for the telemetry will be necessary. In this paper a design strategy for the realization of implantable telemetric microsystems and a building set with different blocks for the creation of a application specific telemetry chip is presented. In addition to the necessary main building blocks like rectifiers, voltage regulators and blocks for the uni- or bi-directional data transmission the set also includes some supplementary blocks like an automatic resonance adjust. All blocks are realized in a standard CMOS process (a 0.7um CMOS process with some analogue add-ons) and therefore very small and cheap systems can be created.
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A modular concept for the design of application specific integrated telemetric systems
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Autor/in / Beteiligte Person: | MARSCHNER, Claudia ; REHFUSS, Sven ; PETERS, Dagmar ; BOLTE, Hilmar ; LAUR, Rainer |
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Quelle: | Design, test, integration, and packaging of MEMS/MOEMS (Cannes, 25-27 April 2001)SPIE proceedings series :246-253 |
Veröffentlichung: | Bellingham WA: SPIE, 2001 |
Medientyp: | Konferenz |
Umfang: | print, 14 ref |
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