Low cycle fatigue models for lead-free solders
In: Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2003), Symposium L: Advances in Materials for Si Microelectronics-From Processing to PackagingThin solid films 462-63:408-412; Jg. 462-63 (2004) S. 408-412
Konferenz
- print, 13 ref
Zugriff:
Low cycle fatigue (LCF) tests for 95.5Sn-3.8Ag-0.7Cu and 99.3Sn-0.7Cu Pb-free solders were conducted for two conditions of 25°C at 1 Hz and 125°C at 0.001Hz. The effect of higher temperature and slower frequency reduces low cycle fatigue endurance. Low cycle fatigue models for 95.5Sn-3.8Ag-0.7Cu and 99.3Sn-0.7Cu Pb-free solders are presented in Coffin-Manson and Morrow models. Comparison with reported Pb-free solder low cycle fatigue properties provides an evaluation of the relative fatigue endurance of Pb-free and Pb-based solders.
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Low cycle fatigue models for lead-free solders
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Autor/in / Beteiligte Person: | PANG, John H. L ; XIONG, B. S ; LOW, T. H |
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Quelle: | Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2003), Symposium L: Advances in Materials for Si Microelectronics-From Processing to PackagingThin solid films 462-63:408-412; Jg. 462-63 (2004) S. 408-412 |
Veröffentlichung: | Lausanne: Elsevier Science, 2004 |
Medientyp: | Konferenz |
Umfang: | print, 13 ref |
ISSN: | 0040-6090 (print) |
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