Examination and evaluation of La2O3 as gate dielectric for sub-100 nm CMOS and DRAM technology
In: Dielectrics in microelectronics (WoDiM 2004)Microelectronics and reliability 45(5-6):937-940; Jg. 45 (2005) 5-6, S. 937-940
Konferenz
- print, 14 ref
Zugriff:
High-k gate dielectric La2O3 thin films have been deposited off Si(100) substrates by molecular beam epitaxy (MBE). Al/La2O3/Si metal-oxide-semiconductor capacitor structures were fabricated and measured. A leakage current of 3 x 10-9 A/cm2 and dielectric constant between 20 and 25 has been measured for samples having an equivalent oxide thickness (EOT) 2.2 nm. The estimated interface state density Dit is around 1 x 1011 eV-1 cm-2. EOT and flat-band voltage were calculated using the NCSU CVC program. The chemical composition of the La2O3 films was measured using X-ray photoelectron spectrometry and Rutherford backscattering. Current density vs. voltage curves show that the La2O3 films have a leakage current several orders of magnitude lower than SiO2 at the same EOT. Thin La2O3 layers survive anneals of up to 900 °C for 30 s with no degradation in electrical properties.
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Examination and evaluation of La2O3 as gate dielectric for sub-100 nm CMOS and DRAM technology
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Autor/in / Beteiligte Person: | CAPODIECI, V ; WIEST, F ; SULIMA, T ; SCHULZE, J ; EISELE, I |
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Quelle: | Dielectrics in microelectronics (WoDiM 2004)Microelectronics and reliability 45(5-6):937-940; Jg. 45 (2005) 5-6, S. 937-940 |
Veröffentlichung: | Oxford: Elsevier, 2005 |
Medientyp: | Konferenz |
Umfang: | print, 14 ref |
ISSN: | 0026-2714 (print) |
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