Substrate preparation for bonding
In: Rubber bonding conference (Frankfurt, 7-8 December 1998), 1998
Konferenz
- print,
Zugriff:
Abrasive Developments have, in conjunction with their Japanese licensee, developed a wet blast phosphating plant that raises the quality standard within the industry. The solution achieved delivers high quality components from an automatic machine that combines both the cleaning and phosphating processes. The cleaning section benefits from the unique degreasing and surface treatment properties of the VAQUA process. Wet blast phosphating (WBP) was first developed some 15 years ago in co-operation with the Yamashita Rubber Company who make anti-vibration rubber and bond it to supporting metal parts exclusively for the Honda Motor Company. Yamashita had two main objectives to achieve from the development of a Wet Blast Phoshating plant: ○ To increase the strength of adhesive bonding between the anti-vibration rubber and the metal parts. ○ To improve the corrosion resistance of the metal parts and hence it's useful life under any weather conditions. In addition to these objectives, the demand for this type of component from the automotive industry as a whole was increasing and the requirement was for it to be phosphated prior to bonding whilst still keeping the cost at an acceptable level. To achieve the improved quality and reduced cost requirements the WBP plant had to operate continuously and automatically process the metal parts for phosphating.
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Substrate preparation for bonding
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Autor/in / Beteiligte Person: | HOLCROFT, R |
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Zeitschrift: | Rubber bonding conference (Frankfurt, 7-8 December 1998), 1998 |
Veröffentlichung: | Shrewsbury: Rapra Technology, 1998 |
Medientyp: | Konferenz |
Umfang: | print, |
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