High-Q above-IC inductors using thin-film wafer-level packaging technology demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA
In: IEEE transactions on advanced packaging, Jg. 29 (2006), Heft 4, S. 810-817
Online
academicJournal
- print, 19 ref
Zugriff:
High-Q inductors are important for the realization of high-performance, low-power RF-circuits. In this paper, on-chip inductors with Q-factors above 40 have been realized above the passivation of a 90-nm RF-CMOS process using wafer-level packaging (WLP) techniques [1]. The influence of a patterned polysilicon and metal ground shield on the inductor-Q is compared and the influence of highly doped active area underneath the inductors is shown. A 5-15 GHz above-IC balun has been realized on 20 Ω · cm silicon with the use of patterned ground shield. The technology is demonstrated by a low-power 90-nm RF-CMOS 5-GHz VCO with a core current consumption of only 150 μA with a 1.2-V supply, and a 10% tuning range with a worst case phase noise of - 111 dBc/Hz at 1-MHz offset. A 24-GHz single-stage common-source low-noise amplifier has been realized, with a noise figure of 3.2 dB, a gain of 7.5 dB, and a low power consumption of10.6 mW.
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High-Q above-IC inductors using thin-film wafer-level packaging technology demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA
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Autor/in / Beteiligte Person: | XIAO, SUN ; DUPUIS, Olivier ; LINTEN, Dimitri ; CARCHON, Geert ; SOUSSAN, Philippe ; DECOUTERE, Stefaan ; DE RAEDT, Walter ; BEYNE, Eric |
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Zeitschrift: | IEEE transactions on advanced packaging, Jg. 29 (2006), Heft 4, S. 810-817 |
Veröffentlichung: | Piscataway, NY: Institute of Electrical and Electronics Engineers, 2006 |
Medientyp: | academicJournal |
Umfang: | print, 19 ref |
ISSN: | 1521-3323 (print) |
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