Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices
In: IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 1, S. 34-37
Online
academicJournal
- print, 10 ref
Zugriff:
Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. Here, we report the design and successful fabrication of a silicon bench that integrates a V-groove and high-frequency coplanar waveguide (CPW) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution.
Titel: |
Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices
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Autor/in / Beteiligte Person: | YANG, H ; ZHU, H. L ; XIE, H. Y ; ZHAO, L. J ; ZHOU, F ; WANG, W |
Link: | |
Zeitschrift: | IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 1, S. 34-37 |
Veröffentlichung: | Piscataway, NY: Institute of Electrical and Electronics Engineers, 2007 |
Medientyp: | academicJournal |
Umfang: | print, 10 ref |
ISSN: | 1521-3323 (print) |
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