Study of plasma charging-induced white pixel defect increase in CMOS active pixel sensor
In: Proceedings of the International Symposium on Dry Process (DPS 2005), Jeju, Korea, November 28-30, 2005Thin solid films 515(12):4864-4868; Jg. 515 (2007) 12, S. 4864-4868
Konferenz
- print, 16 ref
Zugriff:
Plasma process-induced white pixel defect (WPD) of CMOS active pixel sensor (APS) is studied for Si3N4 spacer etch back process by using a magnetically enhanced reactive ion etching (MERIE) system. WPD preferably takes place at the wafer edge region when the magnetized plasma is applied to Si3N4 etch. Plasma charging analysis reveals that the plasma charge-up characteristic is well matching the edge-intensive WPD generation, rather than the UV radiation. Plasma charging on APS transfer gate might lead to a gate leakage, which could play a role in generation of signal noise or WPD. In this article the WPD generation mechanism will be discussed from plasma charging point of view.
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Study of plasma charging-induced white pixel defect increase in CMOS active pixel sensor
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Autor/in / Beteiligte Person: | TOKASHIKI, Ken ; BAI, Keunhee ; BAEK, Kyehyun ; KIM, Yongjin ; MIN, Gyungjin ; CHANGJIN, KANG ; CHO, Hanku ; MOON, Jootae |
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Quelle: | Proceedings of the International Symposium on Dry Process (DPS 2005), Jeju, Korea, November 28-30, 2005Thin solid films 515(12):4864-4868; Jg. 515 (2007) 12, S. 4864-4868 |
Veröffentlichung: | Lausanne: Elsevier Science, 2007 |
Medientyp: | Konferenz |
Umfang: | print, 16 ref |
ISSN: | 0040-6090 (print) |
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