Modeling of strained CMOS on disposable SiGe dots : Shape impacts on electrical/thermal characteristics
In: Solid-state electronics, Jg. 52 (2008), Heft 6, S. 919-925
academicJournal
- print, 13 ref
Zugriff:
We proposed a new non-planar disposable SiGe dot (d-Dot) MOSFET based on Si-on-nothing technology. The new device concepts' relies on self-assembled single-crystalline d-Dot. The d-Dot MOSFET is prone to a particularly high strain/stress from the underlaying SiGe 3D islands. We show that more than 50% higher mobilities of electrons can be obtained as indicated by 3D simulations performed throughout the entire fabrication process. Then, fully-depleted SOI MOSFET and d-Dot MOSFET are compared in term of short channel effects, parasitic capacitance effects and self-heating effects.
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Modeling of strained CMOS on disposable SiGe dots : Shape impacts on electrical/thermal characteristics
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Autor/in / Beteiligte Person: | FRDGONBSE, Sébastien ; YAN, ZHUANG ; BURGHARTZ, Joachim N |
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Zeitschrift: | Solid-state electronics, Jg. 52 (2008), Heft 6, S. 919-925 |
Veröffentlichung: | Oxford: Elsevier Science, 2008 |
Medientyp: | academicJournal |
Umfang: | print, 13 ref |
ISSN: | 0038-1101 (print) |
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