Fabrication of microfluidic devices for packaging CMOS MEMS impedance sensors
In: Microfluidics and nanofluidics (Print), Jg. 7 (2009), Heft 6, S. 869-875
Online
academicJournal
- print, 1/2 p
Zugriff:
This work presents a polydimethylsiloxane (PDMS) microfluidic device for packaging CMOS MEMS impedance sensors. The wrinkle electrodes are fabricated on PDMS substrates to ensure a connection between the pads of the sensor and the impedance instrument. The PDMS device can tolerate an injection speed of 27.12 ml/h supplied by a pump. The corresponding pressure is 643.35 Pa. The bonding strength of the device is 32.44 g/mm2. In order to demonstrate the feasibility of the device, the short circuit test and impedance measurements for air, de-ionized water, phosphate buffered saline (PBS) at four concentrations (1, 2 x 10-4, 1 x 10-4, and 6.7 x 10-5 M) were performed. The experimental results show that the developed device integrated with a sensor can differentiate various samples.
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Fabrication of microfluidic devices for packaging CMOS MEMS impedance sensors
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Autor/in / Beteiligte Person: | JANG, Ling-Sheng ; WU, Chun-Ching ; LIU, Chia-Feng |
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Zeitschrift: | Microfluidics and nanofluidics (Print), Jg. 7 (2009), Heft 6, S. 869-875 |
Veröffentlichung: | Heidelberg: Springer, 2009 |
Medientyp: | academicJournal |
Umfang: | print, 1/2 p |
ISSN: | 1613-4982 (print) |
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