Effects of Substrate Orientation and Channel Stress on Short-Channel Thin SOI MOSFETs
In: I.E.E.E. transactions on electron devices, Jg. 57 (2010), Heft 9, S. 2067-2072
Online
academicJournal
- print, 37 ref
Zugriff:
We present a study of the effects of substrate orientation and longitudinal channel stress on the performance of extremely thin silicon-on-insulator (ETSOI) MOSFETs with gate lengths down to 25 nm. We find that short-channel electron and hole mobilities follow the long-channel mobility trends versus substrate orientation and longitudinal channel stress. We show that with respect to (100) silicon-on-insulator (SOI) substrates, short-channel ETSOI MOSFETs on (110) SOI substrates lead to 25 % enhancement of the p-channel FET drive current at the expense of 12% degradation of the n-channel FET drive current at a fixed OFF-current of 100 nA/μm and a supply voltage of 1 V. Finally, we estimate that an ETSOI complementary metal-oxide-semiconductor (CMOS) on (110) SOI substrates should lead to 10% faster ring oscillators compared with those on (100) SOI wafers, which also implies that (100)-oriented wafers with (110) sidewalls are a better choice for fabricating nonplanar FinFETs and trigate CMOS circuits.
Titel: |
Effects of Substrate Orientation and Channel Stress on Short-Channel Thin SOI MOSFETs
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Autor/in / Beteiligte Person: | MAJUMDAR, Amian ; OUYANG, Christine ; KOESTER, Steven J ; HAENSCH, Wilfried |
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Zeitschrift: | I.E.E.E. transactions on electron devices, Jg. 57 (2010), Heft 9, S. 2067-2072 |
Veröffentlichung: | New York, NY: Institute of Electrical and Electronics Engineers, 2010 |
Medientyp: | academicJournal |
Umfang: | print, 37 ref |
ISSN: | 0018-9383 (print) |
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