Fabrication of Bulk-Si FinFET using CMOS compatible process
In: Microelectronic engineering, Jg. 94 (2012), S. 26-28
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Zugriff:
A new CMOS (Complementary Metal Oxide Semiconductor) compatible Bulk-Si FinFETs fabrication process has been proposed. Compared with conventional fabrication processes of SOI (Silicon On Insulator) and Bulk-Si FinFETs, this new approach is of low cost and simple. High performance CMOS Bulk-Si FinFETs, the fin isolated to Si substrate by oxide, have been fabricated using this new approach. With lower body doping concentration (1 × 15 cm-3). PMOS shows Ion/Ioff ratio of 104 and short channel behavior with a subthreshold swing (SS) of 280 mV/dec, a DIBL (Drain Induced Barrier Lowering) value of 258 mV/V. NMOS device, with the body doping concentration up to 1 x 17 cm-3, shows an Ion/Ioff ratio larger than 107 and SS = 86 mV/dec and DIBL = 28 mV/V.
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Fabrication of Bulk-Si FinFET using CMOS compatible process
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Autor/in / Beteiligte Person: | ZHOU, HUAJIE ; SONG, YI ; XU, QIUXIA ; LI, YONGLIANG ; YIN, HUAXIANG |
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Zeitschrift: | Microelectronic engineering, Jg. 94 (2012), S. 26-28 |
Veröffentlichung: | Amsterdam: Elsevier, 2012 |
Medientyp: | academicJournal |
Umfang: | print, 10 ref |
ISSN: | 0167-9317 (print) |
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