Patterning of CIGS thin films induced by rear-side laser ablation of polyimide carrier foil
In: Applied physics. A, Materials science & processing (Print), Jg. 113 (2013), Heft 2, S. 309-313
Online
academicJournal
- print, 25 ref
Zugriff:
Laser patterning of thin films is essential for the future development of flexible electronic devices. The damage-free scribing of thermally sensitive thin films such as copper―indium―gallium diselenide (CIGS) that is required for solar module fabrication by integrated interconnections is still challenging. In this study a new approach for non-thermal, damage-free scribing of CIGS films on polyimide foil is proposed and demonstrated. In contrast to the usually used direct laser ablation of the thin-film stack, laser ablation of the polyimide carrier foil at laser fluences higher than 3 J/cm2 is utilized to achieve CIGS film delamination and thus the patterning of the thin film. The edges of the patterned CIGS films do not show typical laser-ablation-induced modifications like melting, debris contamination, or crack formation. The mechanism of the thin-film removal is of non-thermal origin and is probably due to stress formation at the CIGS/Mo interface resulting from secondary processes of polyimide laser ablation like shock-wave formation or local sample deformation.
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Patterning of CIGS thin films induced by rear-side laser ablation of polyimide carrier foil
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Autor/in / Beteiligte Person: | EHRHARDT, Martin ; WEHRMANN, Anja ; LORENZ, Pierre ; ZIMMER, Klaus |
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Zeitschrift: | Applied physics. A, Materials science & processing (Print), Jg. 113 (2013), Heft 2, S. 309-313 |
Veröffentlichung: | Heidelberg: Springer, 2013 |
Medientyp: | academicJournal |
Umfang: | print, 25 ref |
ISSN: | 0947-8396 (print) |
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