GaAs MQW modulators integrated with silicon CMOS
In: IEEE photonics technology letters, Jg. 7 (1995), Heft 4, S. 360-362
Online
academicJournal
- print, 10 ref
Zugriff:
We demonstrate integration of GaAs-AlGaAs multiple quantum well modulators to silicon CMOS circuitry via flip-chip solder-bonding followed by substrate removal. We obtain 95% device yield for 32 × 32 arrays of devices with 15 micron solder pads. We show operation of a simple circuit composed of a modulator and a CMOS transistor.
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GaAs MQW modulators integrated with silicon CMOS
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Autor/in / Beteiligte Person: | GOOSSEN, K. W ; WALKER, J. A ; LENTINE, A. L ; MILLER, D. A. B ; D'ASARO, L. A ; HUI, S. P ; TSENG, B ; LEIBENGUTH, R ; KOSSIVES, D ; BACON, D. D ; DAHRINGER, D ; CHIROVSKY, L. M. F |
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Zeitschrift: | IEEE photonics technology letters, Jg. 7 (1995), Heft 4, S. 360-362 |
Veröffentlichung: | New York, NY: Institute of Electrical and Electronics Engineers, 1995 |
Medientyp: | academicJournal |
Umfang: | print, 10 ref |
ISSN: | 1041-1135 (print) |
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