Epitaxial silicon deposition at 300°C with remote plasma processing using SiH4/H2 mixtures
In: Applied physics letters, Jg. 59 (1991), Heft 3, S. 339-341
Online
academicJournal
- print, 18 ref
Zugriff:
Epitaxial Si films have been deposited on Si(100) at 300°C by remote plasma-enhanced chemical vapor deposition using SiH4/H2 mixtures with deposition rates as high as 25 Å/min at these low temperatures. Hall measurements of the film show an unintentional doping level of about 1×1017 cm-3 with electron mobilities of 700 cm2V-1s-1. Critical to the process is the in situ cleaning of the silicon substrate surface prior to deposition.
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Epitaxial silicon deposition at 300°C with remote plasma processing using SiH4/H2 mixtures
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Autor/in / Beteiligte Person: | HATTANGADY, S. V ; POSTHILL, J. B ; FOUNTAIN, G. G ; RUDDER, R. A ; MANTINI, M. J ; MARKUNAS, R. J |
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Zeitschrift: | Applied physics letters, Jg. 59 (1991), Heft 3, S. 339-341 |
Veröffentlichung: | Melville, NY: American Institute of Physics, 1991 |
Medientyp: | academicJournal |
Umfang: | print, 18 ref |
ISSN: | 0003-6951 (print) |
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