Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations
In: Journal of Electromagnetic Engineering and Science, Jg. 24 (2024), Heft 1, S. 26-33
Online
academicJournal
Zugriff:
This paper proposes a novel packaging and large-scale antenna-assembled structure for a printed circuit board (PCB) that reinforces productivity, facilitates cost reduction, and maintains reliability. This was achieved by splitting the antenna from the main board and packaging it into a radio-frequency integrated circuit. In addition, two innovative solutions—an externally attachable flexible PCB antenna and a PCB-embedded coaxial line—are introduced to overcome the degradation in antenna performance and vertical RF transition loss in the proposed low-cost hybrid PCB. First, the proposed externally attachable flexible PCB antenna and a parasitic air-coupled antenna, which were easily assembled on the PCB, achieved an antenna efficiency of 95% and an impedance bandwidth of 7 GHz. Second, the fabricated coaxial line exhibited enhanced impedance matching over a wide frequency range of 30–40 GHz and improved insertion loss of approximately 1.4 dB. Furthermore, the packaged antenna, composed of 256 dual-polarized antenna elements per stream, incorporated a 39 GHz CMOS-based 16-channel phased-array transceiver IC. The set-level beam-forming measurements were verified considering an effective isotropic radiated power of 55 dBm at boresight and a steering range >±60°. In addition to being suitable for mass production in terms of cost and reliability, the proposed structures and solutions met the required antenna and beam-forming performance for commercial 39 GHz base stations without sacrificing performance.
Titel: |
Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations
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Autor/in / Beteiligte Person: | Lee, Youngju ; Ha, Dohyuk ; Baek, Kwanghyun ; Lee, Juneseok ; Park, Sanghoon ; Park, Jung-Ho ; Heo, Jinsu ; Jae Hee Kim |
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Zeitschrift: | Journal of Electromagnetic Engineering and Science, Jg. 24 (2024), Heft 1, S. 26-33 |
Veröffentlichung: | The Korean Institute of Electromagnetic Engineering and Science, 2024 |
Medientyp: | academicJournal |
ISSN: | 2671-7255 (print) ; 2671-7263 (print) |
DOI: | 10.26866/jees.2024.1.r.201 |
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