Damage Assessment Structure of Thermal-Annealing Post-Processing on CMOS LSIs
In: 35th International Conference on Microelectronic Test Structure (ICMTS); (2023-03-27) S. 1-4
Konferenz
Zugriff:
Titel: |
Damage Assessment Structure of Thermal-Annealing Post-Processing on CMOS LSIs
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Autor/in / Beteiligte Person: | Okamoto, Yuki ; Makimoto, Natsumi ; Misumi, Kei ; Kobayashi, Takeshi ; Mita, Yoshio ; Ichiki, Masaaki |
Quelle: | 35th International Conference on Microelectronic Test Structure (ICMTS); (2023-03-27) S. 1-4 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-4653-4 (print) ; 979-8-3503-4652-7 (print) |
ISSN: | 2158-1029 (print) |
DOI: | 10.1109/ICMTS55420.2023.10094159 |
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