Controlling Underfill on Die in Multichip Heterogenous Integration With Large Die Height Delta
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 13 (2023-09-01), Heft 9, S. 1510-1515
Online
academicJournal
Zugriff:
Titel: |
Controlling Underfill on Die in Multichip Heterogenous Integration With Large Die Height Delta
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Autor/in / Beteiligte Person: | Lin, Z. ; Li, W. ; Cetegen, E. ; Guo, Y. ; Liu, N. ; Okafor, I. ; Mehta, V. ; Brun, X. ; Zhong, S. ; Li, H. ; Rumer, C. |
Link: | |
Zeitschrift: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 13 (2023-09-01), Heft 9, S. 1510-1515 |
Veröffentlichung: | 2023 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) ; 2156-3985 (print) |
DOI: | 10.1109/TCPMT.2023.3312037 |
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