TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations
In: IEEE/ACM International Conference on Computer Aided Design (ICCAD); (2023-10-28) S. 1-9
Konferenz
Zugriff:
Titel: |
TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations
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Autor/in / Beteiligte Person: | Wang, Dengfeng ; Xu, Liukai ; Liu, Songyuan ; Li, Zhi ; Chen, Yiming ; He, Weifeng ; Li, Xueqing ; Sun, Yanan |
Quelle: | IEEE/ACM International Conference on Computer Aided Design (ICCAD); (2023-10-28) S. 1-9 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-2225-5 (print) |
ISSN: | 1558-2434 (print) |
DOI: | 10.1109/ICCAD57390.2023.10323889 |
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