Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 13 (2023-12-01), Heft 12, S. 1998-2007
Online
academicJournal
Zugriff:
Titel: |
Investigation on Impedance Optimization for the BGA-Bonding Wire Transition Structure
|
---|---|
Autor/in / Beteiligte Person: | Song, K. ; Gao, J. ; Flowers, G.T. ; Wang, Z. ; Wang, C. ; Yi, W. ; Cheng, Z. |
Link: | |
Zeitschrift: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 13 (2023-12-01), Heft 12, S. 1998-2007 |
Veröffentlichung: | 2023 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) ; 2156-3985 (print) |
DOI: | 10.1109/TCPMT.2023.3336631 |
Sonstiges: |
|