CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory
In: International Electron Devices Meeting (IEDM); (2023-12-09) S. 1-4
Konferenz
Zugriff:
Titel: |
CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory
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Autor/in / Beteiligte Person: | Tagami, Masayoshi |
Quelle: | International Electron Devices Meeting (IEDM); (2023-12-09) S. 1-4 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-2767-0 (print) |
ISSN: | 2156-017X (print) |
DOI: | 10.1109/IEDM45741.2023.10413718 |
Sonstiges: |
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