Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs
In: IEEE Transactions on Electron Devices, Jg. 71 (2024-03-01), Heft 3, S. 1999-2004
Online
academicJournal
Zugriff:
Titel: |
Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs
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Autor/in / Beteiligte Person: | Yin, L. ; Zhou, H. ; Ji, X. ; Li, J. ; Wang, K. ; Li, C. ; Zhang, J. |
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Zeitschrift: | IEEE Transactions on Electron Devices, Jg. 71 (2024-03-01), Heft 3, S. 1999-2004 |
Veröffentlichung: | 2024 |
Medientyp: | academicJournal |
ISSN: | 0018-9383 (print) ; 1557-9646 (print) |
DOI: | 10.1109/TED.2024.3358782 |
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