Capacitive-based Wire Bonding Defects Detection Method for Integrated Circuit Package in Strip Form with Hybrid Threshold Setting Algorithm
In: IEEE 25th Electronics Packaging Technology Conference (EPTC); (2023-12-05) S. 918-921
Konferenz
Zugriff:
Titel: |
Capacitive-based Wire Bonding Defects Detection Method for Integrated Circuit Package in Strip Form with Hybrid Threshold Setting Algorithm
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Autor/in / Beteiligte Person: | Qiu, Tie ; Khoo, Leslie ; Tan, Joseph ; Loo, Amy |
Quelle: | IEEE 25th Electronics Packaging Technology Conference (EPTC); (2023-12-05) S. 918-921 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-2957-5 (print) |
DOI: | 10.1109/EPTC59621.2023.10457591 |
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