Optimization of the CMP process for direct wafer-to-wafer oxide bonding
In: IEEE 25th Electronics Packaging Technology Conference (EPTC); (2023-12-05) S. 421-424
Konferenz
Zugriff:
Titel: |
Optimization of the CMP process for direct wafer-to-wafer oxide bonding
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Autor/in / Beteiligte Person: | Ji, Hong-Miao ; Cheemalamarri, Hemanth Kumar ; Chi, Ting-Ta ; Serene, Hui-ting Lim ; Teo Dickson, Wei-Jie ; Alfred, Siang-Kiat Neo ; Li, Hong-Yu ; Jon, Gim-Guan Chen ; Venkataraman, Nandini ; Lee, Wen |
Quelle: | IEEE 25th Electronics Packaging Technology Conference (EPTC); (2023-12-05) S. 421-424 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-2957-5 (print) |
DOI: | 10.1109/EPTC59621.2023.10457749 |
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