Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 14 (2024-04-01), Heft 4, S. 611-618
Online
academicJournal
Zugriff:
Titel: |
Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages
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Autor/in / Beteiligte Person: | Shen, W. ; Lei, Z. ; Liang, K. ; Wu, G. ; Zeng, T. ; Liu, S. |
Link: | |
Zeitschrift: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 14 (2024-04-01), Heft 4, S. 611-618 |
Veröffentlichung: | 2024 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) ; 2156-3985 (print) |
DOI: | 10.1109/TCPMT.2024.3372520 |
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