Signal & Power Integrity Analysis and Solutions for HBM Gen3
In: IEEE Electrical Design of Advanced Packaging and Systems (EDAPS); (2023-12-12) S. 1-3
Konferenz
Zugriff:
Titel: |
Signal & Power Integrity Analysis and Solutions for HBM Gen3
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Autor/in / Beteiligte Person: | Moorthy, Mukesh ; Abed, Hisham |
Quelle: | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS); (2023-12-12) S. 1-3 |
Veröffentlichung: | 2023 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-8376-8 (print) |
ISSN: | 2151-1233 (print) |
DOI: | 10.1109/EDAPS58880.2023.10468102 |
Sonstiges: |
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