Power Integrity Analysis for Interoperability of BoW Chiplet Interfaces
In: 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID); (2024-01-06) S. 660-665
Konferenz
Zugriff:
Titel: |
Power Integrity Analysis for Interoperability of BoW Chiplet Interfaces
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Autor/in / Beteiligte Person: | Mishra, Ishan ; Balachandran, Jayaprakash ; Liew, Wen-Sin ; Alon, Elad ; Venkataraman, Srinivas ; Gupta, Shalabh |
Quelle: | 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID); (2024-01-06) S. 660-665 |
Veröffentlichung: | 2024 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-8440-6 (print) |
ISSN: | 2380-6923 (print) |
DOI: | 10.1109/VLSID60093.2024.00117 |
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