A solder bumping interconnect technology for high-power devices
In: IEEE 35th Annual Power Electronics Specialists Conference; Jg. 6 (2004) S. 4183-4187
Konferenz
Zugriff:
Titel: |
A solder bumping interconnect technology for high-power devices
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Autor/in / Beteiligte Person: | Hase, K. ; Lefranc, G. ; Zellner, M. ; Licht, T. |
Quelle: | IEEE 35th Annual Power Electronics Specialists Conference; Jg. 6 (2004) S. 4183-4187 |
Veröffentlichung: | 2004 |
Medientyp: | Konferenz |
ISBN: | 0-7803-8399-0 (print) ; 978-0-7803-8399-9 (print) |
ISSN: | 0275-9306 (print) |
DOI: | 10.1109/PESC.2004.1354739 |
Sonstiges: |
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