Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging
In: International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); (2009-08-01) S. 485
Konferenz
Zugriff:
Titel: |
Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging
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Autor/in / Beteiligte Person: | Zhao, Kun ; Wang, Changhai |
Quelle: | International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); (2009-08-01) S. 485 |
Veröffentlichung: | 2009 |
Medientyp: | Konferenz |
ISBN: | 978-1-4244-4658-2 (print) ; 978-1-4244-4659-9 (print) |
DOI: | 10.1109/ICEPT.2009.5270703 |
Sonstiges: |
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