Advanced Multilayer Thick-Film System-on-Package Technology for Miniaturized and High Performance CPW Microwave Passive Components
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 1 (2011-11-01), Heft 11, S. 1695-1705
Online
academicJournal
Zugriff:
Titel: |
Advanced Multilayer Thick-Film System-on-Package Technology for Miniaturized and High Performance CPW Microwave Passive Components
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Autor/in / Beteiligte Person: | Samanta, K. K. ; Robertson, I. D. |
Link: | |
Zeitschrift: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 1 (2011-11-01), Heft 11, S. 1695-1705 |
Veröffentlichung: | 2011 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) ; 2156-3985 (print) |
DOI: | 10.1109/TCPMT.2011.2167231 |
Sonstiges: |
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