A cost effective TO-CAN packaged 10 Gbps EML module employing inductance compensation technique
In: IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan); (2013-11-01) S. 1-4
Konferenz
Zugriff:
Titel: |
A cost effective TO-CAN packaged 10 Gbps EML module employing inductance compensation technique
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Autor/in / Beteiligte Person: | Shirao, Mizuki ; Ohata, Nobuo ; Uto, Kenichi ; Aruga, Hiroshi |
Quelle: | IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan); (2013-11-01) S. 1-4 |
Veröffentlichung: | 2013 |
Medientyp: | Konferenz |
ISBN: | 978-1-4799-2718-0 (print) ; 978-1-4799-0875-2 (print) ; 978-1-4799-0877-6 (print) |
ISSN: | 2373-5449 (print) |
DOI: | 10.1109/ICSJ.2013.6756087 |
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