Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
In: IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm); (2014-05-01) S. 851-861
Konferenz
Zugriff:
Titel: |
Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
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Autor/in / Beteiligte Person: | Wunderle, B. ; Springborn, M. ; May, D. ; Manier, C. A. ; Abo Ras, M. ; Mrossko, R. ; Oppermann, H. ; Xhonneux, T. ; Caroff, T. ; Maurer, W. ; Mitova, R. |
Quelle: | IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm); (2014-05-01) S. 851-861 |
Veröffentlichung: | 2014 |
Medientyp: | Konferenz |
ISBN: | 978-1-4799-5267-0 (print) |
ISSN: | 1087-9870 (print) |
DOI: | 10.1109/ITHERM.2014.6892370 |
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