Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip In Flex) package for wearable electronics applications
In: Pan Pacific Microelectronics Symposium (Pan Pacific); (2016) S. 1-4
Konferenz
Zugriff:
Titel: |
Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip In Flex) package for wearable electronics applications
|
---|---|
Autor/in / Beteiligte Person: | Paik, Kyung W. ; Kim, Ji-Hye ; Kim, Young R. |
Quelle: | Pan Pacific Microelectronics Symposium (Pan Pacific); (2016) S. 1-4 |
Veröffentlichung: | 2016 |
Medientyp: | Konferenz |
ISBN: | 978-0-9888873-9-8 (print) ; 978-1-944543-90-7 (print) |
DOI: | 10.1109/PanPacific.2016.7428422 |
Sonstiges: |
|