Plastic encapsulated ICs bonding reliability risk assessment at HT automotive application
In: IEEE 30th International Conference on Microelectronics (MIEL); (2017-10-01) S. 117-120
Konferenz
Zugriff:
Titel: |
Plastic encapsulated ICs bonding reliability risk assessment at HT automotive application
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Autor/in / Beteiligte Person: | Blyzniuk, M. ; Devos, A. ; Furman, M. |
Quelle: | IEEE 30th International Conference on Microelectronics (MIEL); (2017-10-01) S. 117-120 |
Veröffentlichung: | 2017 |
Medientyp: | Konferenz |
ISBN: | 978-1-5386-2561-3 (print) ; 978-1-5386-2563-7 (print) ; 978-1-5386-2562-0 (print) |
ISSN: | 2159-1679 (print) |
DOI: | 10.1109/MIEL.2017.8190082 |
Sonstiges: |
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