A Study on the Dynamic Bending Reliability of Chip-in-Fabrics(CIF) Packages Using Anisotropic Conductive Films (Acfs) Materials For Flexible Electronic Applications
In: Pan Pacific Microelectronics Symposium (Pan Pacific); (2020-02-01) S. 1-5
Konferenz
Zugriff:
Titel: |
A Study on the Dynamic Bending Reliability of Chip-in-Fabrics(CIF) Packages Using Anisotropic Conductive Films (Acfs) Materials For Flexible Electronic Applications
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Autor/in / Beteiligte Person: | Jung, Seung-Yoon ; Paik, Kyung-Wook |
Quelle: | Pan Pacific Microelectronics Symposium (Pan Pacific); (2020-02-01) S. 1-5 |
Veröffentlichung: | 2020 |
Medientyp: | Konferenz |
ISBN: | 978-1-944543-14-3 (print) |
DOI: | 10.23919/PanPacific48324.2020.9059461 |
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