DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing
In: 2020 50th European Microwave Conference (EuMC); (2021-01-12) S. 252-255
Konferenz
Zugriff:
Titel: |
DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing
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Autor/in / Beteiligte Person: | Qayyum, Jubaid Abdul ; Crump, Cameron ; Albrecht, John ; Ulusoy, Ahmet Cagri ; Papapolymerou, John |
Quelle: | 2020 50th European Microwave Conference (EuMC); (2021-01-12) S. 252-255 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-2-87487-059-0 (print) ; 978-2-87487-058-3 (print) |
DOI: | 10.23919/EuMC48046.2021.9338006 |
Sonstiges: |
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