Stress adjusting for hillock size reduction in UTS CIS base on graphics analysis
In: 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM); (2021-04-08) S. 1-3
Konferenz
Zugriff:
Titel: |
Stress adjusting for hillock size reduction in UTS CIS base on graphics analysis
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Autor/in / Beteiligte Person: | Hu, Xianghua ; He, Guangzhi ; Gu, Xiaofang ; Ni, Qiliang |
Quelle: | 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM); (2021-04-08) S. 1-3 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-1-7281-8176-9 (print) |
DOI: | 10.1109/EDTM50988.2021.9420834 |
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