Chiplets in Wafers (CiW) - Process Design Kit and Demonstration of High-Frequency Circuits with GaN Chiplets in Silicon Interposers
In: IEEE 71st Electronic Components and Technology Conference (ECTC); (2021-06-01) S. 178-184
Konferenz
Zugriff:
Titel: |
Chiplets in Wafers (CiW) - Process Design Kit and Demonstration of High-Frequency Circuits with GaN Chiplets in Silicon Interposers
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Autor/in / Beteiligte Person: | Herrault, Florian ; Wong, Joel ; Ramos, Ignacio ; Tai, Haw ; King, Matthew |
Quelle: | IEEE 71st Electronic Components and Technology Conference (ECTC); (2021-06-01) S. 178-184 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-4097-4 (print) |
ISSN: | 2377-5726 (print) |
DOI: | 10.1109/ECTC32696.2021.00039 |
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