Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating Process
In: 22nd International Conference on Electronic Packaging Technology (ICEPT); (2021-09-14) S. 1-4
Konferenz
Zugriff:
Titel: |
Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating Process
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Autor/in / Beteiligte Person: | Jin, Yinuo ; Zheng, Bo ; Wang, Jian ; Wang, David H. ; Yu, Qixing |
Quelle: | 22nd International Conference on Electronic Packaging Technology (ICEPT); (2021-09-14) S. 1-4 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-1391-6 (print) |
DOI: | 10.1109/ICEPT52650.2021.9567719 |
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