Capacitive Sensors Integrated in SIW Structures – A Proof of Concept
In: 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC); (2021-09-13) S. 1-4
Konferenz
Zugriff:
Titel: |
Capacitive Sensors Integrated in SIW Structures – A Proof of Concept
|
---|---|
Autor/in / Beteiligte Person: | Buiculescu, Valentin ; Baracu, Angela Mihaela ; Buiculescu, Cristina |
Quelle: | 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC); (2021-09-13) S. 1-4 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-0-9568086-7-7 (print) |
DOI: | 10.23919/EMPC53418.2021.9584960 |
Sonstiges: |
|