The IEEE EPS Packaging Benchmark Suite
In: IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS); (2021-10-17) S. 1-4
Konferenz
Zugriff:
Titel: |
The IEEE EPS Packaging Benchmark Suite
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Autor/in / Beteiligte Person: | Guo, Fei ; Aygun, Kemal ; Becker, W. Dale ; Talocia, Stefano Grivet ; Hejase, Jose A. ; Wong, Wui-Weng ; Zhou, Tingdong ; Barnes, Heidi ; Peng, Zhen ; Pelger, Alexander ; Sahouli, Mohamed ; Schutt-Aine, Jose ; Ling, Feng ; Griese, Elmar ; Paladhi, Pavel Roy ; Sharma, Rohit ; Pham, Nam ; Winkel, Thomas-Michael ; Fledell, Evan ; Hill, Michael J. ; Silva, Benjamin ; Hu, Kaisheng ; Aronsson, Jonatan ; Liu, Chang ; Jeong, Yiru ; Yilmaz, Ali E. |
Quelle: | IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS); (2021-10-17) S. 1-4 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-4269-5 (print) |
ISSN: | 2165-4115 (print) |
DOI: | 10.1109/EPEPS51341.2021.9609142 |
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