Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests
In: IEEE Transactions on Power Electronics, Jg. 37 (2022-06-01), Heft 6, S. 6647-6659
Online
academicJournal
Zugriff:
Titel: |
Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests
|
---|---|
Autor/in / Beteiligte Person: | Chen, C. ; Kim, D. ; Zhang, Z. ; Wakasugi, N. ; Liu, Y. ; Hsieh, M. ; Zhao, S. ; Suetake, A. ; Suganuma, K. |
Link: | |
Zeitschrift: | IEEE Transactions on Power Electronics, Jg. 37 (2022-06-01), Heft 6, S. 6647-6659 |
Veröffentlichung: | 2022 |
Medientyp: | academicJournal |
ISSN: | 0885-8993 (print) ; 1941-0107 (print) |
DOI: | 10.1109/TPEL.2022.3142286 |
Sonstiges: |
|