Optimizing the Nano Wiring and KlettSintering parameters for low-temperature die to DCB attach of power electronic chips
In: 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT); (2021-12-21) S. 31-34
Konferenz
Zugriff:
Titel: |
Optimizing the Nano Wiring and KlettSintering parameters for low-temperature die to DCB attach of power electronic chips
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Autor/in / Beteiligte Person: | Strahringer, D. ; Roustaie, F. ; Weissenborn, F. ; Quednau, S. ; Wilde, J. |
Quelle: | 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT); (2021-12-21) S. 31-34 |
Veröffentlichung: | 2021 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-3191-0 (print) |
ISSN: | 2150-5942 (print) |
DOI: | 10.1109/IMPACT53160.2021.9696635 |
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