Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing
In: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE); (2022-04-25) S. 1-8
Konferenz
Zugriff:
Titel: |
Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing
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Autor/in / Beteiligte Person: | Gleichauf, Jonas ; Maniar, Youssef ; Kuczynska, Marta ; Metasch, Rene ; Roellig, Mike ; Wiese, Steffen |
Quelle: | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE); (2022-04-25) S. 1-8 |
Veröffentlichung: | 2022 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-5836-8 (print) |
DOI: | 10.1109/EuroSimE54907.2022.9758920 |
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