Case Study For STI-LDNMOS Burned During HCI Stress to Passing Reliability Specifications
In: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA); (2022-07-18) S. 1-4
Konferenz
Zugriff:
Titel: |
Case Study For STI-LDNMOS Burned During HCI Stress to Passing Reliability Specifications
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Autor/in / Beteiligte Person: | Chu, Wei-Cheng ; Tsai, Bo-An ; Yoshida, Hiroshi ; Chen, Yi-Heng ; Hsu, Yung-Lung |
Quelle: | IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA); (2022-07-18) S. 1-4 |
Veröffentlichung: | 2022 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-9815-9 (print) |
ISSN: | 1946-1550 (print) |
DOI: | 10.1109/IPFA55383.2022.9915705 |
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