Thermal solution for Co-Packaged Optics (CPO) modules
In: IEEE Electrical Design of Advanced Packaging and Systems (EDAPS); (2022-12-12) S. 1-3
Konferenz
Zugriff:
Titel: |
Thermal solution for Co-Packaged Optics (CPO) modules
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Autor/in / Beteiligte Person: | Matsumoto, Keiji ; Farooq, Mukta ; Knickerbocker, John |
Quelle: | IEEE Electrical Design of Advanced Packaging and Systems (EDAPS); (2022-12-12) S. 1-3 |
Veröffentlichung: | 2022 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-9194-5 (print) |
ISSN: | 2151-1233 (print) |
DOI: | 10.1109/EDAPS56906.2022.9994909 |
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